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PU200封装胶

       PU200 has been developed as a cold pour system to encapsulate piezo sensors and to stick surface mounted sensors.  

The material is available in 4kg kits. 

METHOD OF USE  

       The resin is a filled system and therefore some degree of sedimentation may occur, particularly if the resin has been left standing over long periods of time or stored at elevated temperatures (in excess of 25oC).  This can be readily dispersed by mixing with an electric drill and suitable attachment or a broad bladed spatula. 


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